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11th IEEE Latin-American Test Workshop
(LATW 2010)

March 28-31, 2010
Barradas Hotel, Punta del Este, Uruguay

http://latw.tttc-events.org

Submission Deadline Extended to November 15th, 2009!
CALL FOR PAPERS

Scope

The IEEE Latin-American Test Workshop provides an annual forum for test and fault tolerance professionals and technologists from Latin America and all over the world to present and discuss various aspects of system, board and component testing and fault-tolerance with design, manufacturing and field considerations in mind.

Topics of interest include but are not limited to:

Analog Mixed Signal Test
Automatic Test Generation
Board and System Test
Built-In Self-Test
Defect-Based Test
Design and Synthesis for Testability
Design Verification/Validation
Design for Manufacturability
Design of Reliable Embedded Software
D&T for Electromagnetic Compatibility

Economics of Test
Fault Analysis and Diagnosis
Fault Modeling and Simulation
Fault-Tolerance in HW/SW
Memory Test and Repair
On-Line Testing
Process Control and Measurements
Radiation Hardening Techniques
System-on-Chip Test
Yield Optimization

Topic Coordinators:

  • Analog and Mixed-Signal - M. Renovell - LIRMM, France
  • DFT & BIST - A. Orailoglu, UC San Diego, USA
  • Electromagnetic Compatibility - E. Sicard, INSA Toulouse, France
  • On-line Test and Fault Tolerance - D. K. Pradhan, Univ. of Bristol, UK
  • Radiation Ground Testing - F. L. Kastensmidt, UFRGS, Brazil
  • Software Testing - S. Vergilio, UFPR, Brazil
  • Verification and High Level Test - M. P. Garcia, Univ. Carlos III, Spain

Submissions

Those interested in presenting recent results at the workshop are invited to submit either an extended abstract, one to three pages long, or a full length paper. PDF electronic submissions should be done via the workshop webpage: http://latw.tttc-events.org/.

Authors should send papers in the IEEE format with a cover letter indicating the complete mail address, phone/fax numbers and e-mail addresses, of the contact person and the presenter. Detailed instructions are available at the workshop web page. The Program Committee also welcomes proposals for panels and special topic sessions. For additional information please contact one of the Program Chairs.

Fabian Vargas vargas@computer.org
Erika Cota erika@inf.ufrgs.br

Key Dates

Submission deadline: November 15th, 2009
Notification of acceptance: December 15th, 2009
Final copy deadline: January 15th, 2010

Venue

LATW2010 will be held in Punta del Este, Uruguay, considered as being one of the most beautiful and prestigious seaside resorts in South America. Punta del Este can be easily reached by bus shuttle (about one hour, buses every hour) from the Montevideo International Airport. Uruguay is a neuralgic point of the Southern Common Market (Mercosur), between its two largest Member States: Argentina (two-hour ferryboat trip to Buenos Aires) and Brazil ( two hours flight to the cities of Porto Alegre, Sao Paulo or Rio de Janeiro). At less than two-hour drive from Montevideo can be found Colonia del Sacramento, founded by the Portuguese in 1680, declared Cultural Humanity Heritage by Unesco.

Committees

General Chairs
R.Velazco - TIMA, France
raoul.velazco@imag.fr
Y. Zorian – Virage Logic Corp., USA
yervant.zorian@viragelogic.com

Program Chairs
F. Vargas - PUCRS, Brazil
E. Cota – UFRGS, Brazil

Local Chair
S. Fernandez– UDELAR, Uruguay
J.P. Oliver - UDELAR, Uruguay

Publication Chair
M. Lubaszewski, UFRGS, Brazil

Finance Chair
A. L. Fourneret-Itié – TIMA, France

Panel Chairs
M. Abadir – Freescale, USA
E. Bezerra - PUCRS, Brazil

Embedded Tutorials Chairs
M. Sonza Reorda - POLITO, Italy
L. Bolzani– PUCRS, Brazil

Publicity Chairs
N. Zergainoh - TIMA, France
R.Reis - UFRGS, Brazil

Industry Liaisons
C. Duenãs, Freescale, Brazil
D. Lupi, FAN, Argentina

SBMicro Liaison
R. Ribas, UFRGS, Brazil

IEEE D&T Liaison
K. Roy – Purdue Univ., USA

TTEP Tutorials Liaison
V. Champac - INAOE, Mexico

West Europe Liaison
M. L. Flottes - LIRMM, France

East Europe Liaison
R. Ubar - Tallinn Tech. Univ., Estonia

North-America Liaison
V.D. Agrawal, Auburn University, USA

Asia Liaison
Y. Mita, Univ. Tokyo, Japan

Program Committee
J. Abraham - Univ. Texas, USA
F. Azaïs - LIRMM, France
L. S. Balado - UPC, Spain
M. Benabdenbi - LIP6 / Univ. Paris VI, France
A. Brun - Univ. Paris-Sud, France
C. S. Cardenas - PUCP, Peru
A. Chatterjee - Georgia Tech., USA
A. O. Fernandes - UFMG, Brazil
V. A. Fernandez - Freescale, Mexico
J. Figueras - UPC, Spain
F. Fiori - POLITO, Italy
P. Fouillat - CNFM, France
J. L. Guntzel - UFSC, Brazil
J. P. Gyvez - NXP, The Netherlands
C. F. Hawkins - UNM, USA
J. P. Hayes - Univ. Michigan, USA
A. Ivanov - Univ. British Columbia, Canada
M. Jenihhin - Tallinn Tech. Univ., Estonia
P. Machado - DSC/UFCG, Brazil
E. J. Marinissen - NXP, The Netherlands
F. Moraes - PUCRS, Brazil
J. Rayas-Sanchez - ITESO, Mexico
M. C. Ribeiro - INPE-LIT, Brazil
G. Peretti - UTN-FR Villa Maria, Argentina
J. Perez - Fac. de Ing., UDELAR, Uruguay
E. Romero - UTN-FR Villa Maria, Argentina
A. Rueda - IMSE-CNM, Spain
J. Segura - U. Illes Balears, Spain
M. Soma - Univ. Washington, USA
J. Sosnowski - Warsaw Univ. Techn., Poland
J. P. Teixeira - IST/INESC-ID, Portugal
J. Velasco-Medina - Univ. del Valle, Colombia
A. Weber - UFPR, Brazil
T. S. Weber - UFRGS. Brazil
H. J. Wunderlich - Univ. of Stuttgart, Germany
Q. Xu - University of Hong Kong, China
A. Zorzo - PUCRS, Brazil

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Submission: LATW 2010, Punta del Este, Uruguay