The article "A non-blocking non-degrading multiple defects link testing method for 3D-Networks-on-Chip" by Khanh N. Dang, Michael Conrad Meyer, Akram Ben Ahmed, and Xuan-Tu Tran has been accepted for publication at IEEE Access.
This is to notify you that the following article, "A non-blocking non-degrading multiple defect link test method for 3D-Networks-on-Chip," is available under the "Early Access" area on IEEE Xplore, where the PDF of your author-submitted, peer-reviewed, and accepted manuscript is available for download. This article has been accepted for publication in a future issue of this journal, but has not been edited and content may change prior to final publication. It may be cited as an article in a future issue by its Digital Object Identifier. To view this article, please visit the journal homepage (listed below) on IEEE Xplore and select the ?Early Access? tab. This paper appears in: IEEE Access On page(s): 1-19 Print ISSN: 2169-3536 Online ISSN: 2169-3536 Digital Object Identifier: 10.1109/ACCESS.2020.2982836