Congratulations to TRAN Dinh Lam for having a paper accepted to be published on MDPI Electronics journal

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Congratulations to TRAN Dinh Lam for having a paper accepted to be published on MDPI Electronics journal.

Title: An Efficient Hardware Implementation of Residual Data Binarization in HEVC CABAC Encoder
Authors: Dinh-Lam Tran, Xuan-Tu Tran *, Duy-Hieu Bui, Cong-Kha Pham

This is a good news during social distancing period in Vietnam due to Covid-19 pendamic (novel Corona virus-caused pneumonia originated from Wuhan city last year).

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Congratulations to Khanh N. Dang for having a paper "A non-blocking non-degrading multiple defects link testing method for 3D-Networks-on-Chip" accepted for publication at IEEE Access

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The article "A non-blocking non-degrading multiple defects link testing method for 3D-Networks-on-Chip" by Khanh N. Dang, Michael Conrad Meyer, Akram Ben Ahmed, and Xuan-Tu Tran has been accepted for publication at IEEE Access.

This is to notify you that the following article, "A non-blocking non-degrading multiple defect link test method for 3D-Networks-on-Chip," is available under the "Early Access" area on IEEE Xplore, where the PDF of your author-submitted, peer-reviewed, and accepted manuscript is available for download. This article has been accepted for publication in a future issue of this journal, but has not been edited and content may change prior to final publication. It may be cited as an article in a future issue by its Digital Object Identifier. To view this article, please visit the journal homepage (listed below) on IEEE Xplore and select the ?Early Access? tab.

This paper appears in: IEEE Access
On page(s): 1-19
Print ISSN: 2169-3536
Online ISSN: 2169-3536
Digital Object Identifier: 10.1109/ACCESS.2020.2982836
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